A recently filed PlayStation patent suggests that the PS6 will avoid PS5‘s overheating problem by deploying advanced cooling technology. The PS5’s liquid metal cooling reportedly damaged some launch consoles when placed in vertical position — something Sony addressed with the PS5 Slim and PS5 Pro. The PS6 will feature a new type of cooling tech, it seems.
New PlayStation patent suggests PS6 will ditch PS5’s liquid cooling tech
As spotted by Tech4Gamers, the patent filed by Sony Interactive Entertainment specifically mentions “demand for structures with higher cooling performance” when placed in different postures. Sony’s solution is a “heat dissipation device including a heat pipe and a heat sink” that’s used to “cool a heating element such as an IC chip built into the electronic device.”
“Each heat pipe may have a sintered body layer formed by sintering a powder, such as a metal laminated on the inner wall surface of a tube, including the outer surface,” Sony explained. “The sintered body layer may be formed in a cylindrical shape inside the tube, and a cavity may be formed inside the sintered body layer. A working fluid may be sealed inside the tube.”
Sony says the “fluid” will be selected based on the pipe’s material, and could be something as simple as water.
Patents don’t always come to fruition, but it makes sense for this advanced cooling tech to be used in the PS6.
